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2N7002E
Small Signal MOSFET
60 V, 310 mA, Single, N ? Channel, SOT ? 23
Features
?
?
?
?
Low R DS(on)
Small Footprint Surface Mount Package
Trench Technology
These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
V (BR)DSS
60 V
http://onsemi.com
R DS(on) MAX
3.0 W @ 4.5 V
I D MAX
(Note 1)
310 mA
Applications
2.5 W @ 10 V
?
?
?
?
Low Side Load Switch
Level Shift Circuits
DC ? DC Converter
Portable Applications i.e. DSC, PDA, Cell Phone, etc.
Simplified Schematic
N ? Channel
3
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Rating
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
60
± 20
V
V
1
Drain Current (Note 1)
Steady State
T A = 25 ° C
T A = 85 ° C
I D
260
190
mA
2
(Top View)
t<5s
Power Dissipation (Note 1)
Steady State
t<5s
T A = 25 ° C
T A = 85 ° C
P D
310
220
300
420
mW
3
MARKING DIAGRAM
& PIN ASSIGNMENT
Drain
3
Pulsed Drain Current (t p = 10 m s)
Operating Junction and Storage
Temperature Range
Source Current (Body Diode)
I DM
T J , T STG
I S
1.2
? 55 to
+150
300
A
° C
mA
1
2
SOT ? 23
CASE 318
STYLE 21
1
Gate
703 M G
G
2
Source
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8 ″ from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
703 = Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
THERMAL CHARACTERISTICS
Characteristic
Junction ? to ? Ambient ? Steady State
(Note 1)
Symbol
R q JA
Max
417
Unit
° C/W
ORDERING INFORMATION
Device Package Shipping ?
2N7002ET1G SOT ? 23 3000/Tape & Reel
Junction ? to ? Ambient ? t ≤ 5 s (Note 1) R q JA 300
1. Surface ? mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in
sq [1 oz] including traces)
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2011
February, 2011 ? Rev. 3
1
Publication Order Number:
2N7002E/D
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